Technical Introduction: "Proposal for Wafer Precision Processing Process"
We will introduce grinding processing technology, flat grinding technology, and edge polishing, among others.
SpeedFam develops "equipment" and "consumable materials" from both hardware and software perspectives with innovative technology and know-how to meet various customer needs and propose optimal processing processes. Edge polishing, which performs mirror surface processing on wafer edges and notches, is an essential processing technology in the semiconductor manufacturing process. Mirror polishing of edges and notches prevents particle generation and significantly improves surface cleanliness in the device process. 【Technology Introduction】 ○ Polishing processing technology ○ Flat polishing technology ○ Edge polishing (end face polishing), etc. For more details, please contact us or download the catalog.
- 企業：スピードファム
- 価格：Other
